The release of Samsung Galaxy S7 is expected to be in the year 2016. There are many rumours about the features the phone will have. Samsung is about to launch three variants of its next Galaxy flagship i.e. S7, S7 edge and S7 edge+. The launch is going to be at Mobile World Congress 2016 (MWC) to be held in February. Reports claim that Samsung Galaxy S7 might be priced 10 per cent cheaper as compared to its predecessor the Galaxy S6 but the exact pricing is not yet disclosed. As Galaxy S6 was launched around February, most experts expect Galaxy S7 to be launched at around the same time.
According to the rumours the phone will come in two variants having different processors. Samsung Galaxy S7 is supposed to have Exynos 8890 chipset while the other variant will supposedly have Qualcomm’s Snapdragon 820 SoC. As per a report on Taiwan’s Economic Daily News there were claims that Samsung is planning to tackle the heating issues in case of Snapdragon 820 processor with the addition of next generation heating pipes in its phones. A report in the Korean Times stated that Samsung has plans to change the design slightly, sticking to its metal and glass design as seen in S6 and the S6 edge. The rumour makes sense as the metal and glass design were also incorporated in new Galaxy A series for 2016 and in Galaxy Note 5 which is a top-end Samsung device.
Galaxy S7 will provide an improved picture quality and performance with some new features added. A report on Sammobile claims that like Nexus 6P, LG Nexus 5X and OnePlus 2, S7 will be joining the league to Type-C USB phones. Reports also claim that the phone will be getting back the micro-SD slot with the S7.