For quite some time we have been hearing of Apple’s upcoming iPhone 7. We have been hearing rumors in large quantities also there have been several leaks. The latest rumor is about the development in production, also some of the image leaks reveal information about storage, SIM slots, and the much whispered 3.5mm headphone jack.
Rock Fix, the Chinese repair shop was the first to leak information with the help of Engadget. Some images of alleged iPhone 7 parts have been posted by the Chinese repair shop online that hints at possible key specs. First to be seen was a picture of the 4.7-inch iPhone 7 Lightning cable assembly that indicates that the 3.5mm headphone jackis still there. In contradiction to previous report the image shows that the headphone jack slot is still attached. Earlier it was heard that in favor of sound accessories being attached through the Lightning port or Bluetooth, Apple would ditch the 3.5mm audio jack.
Another image shows that the iPhone 7 may be having dual SIM trays, which will be the first in Apple’s iPhone lineup. It also reveals a SanDisk memory chip that shows that it may have a 256GB option. Earlier reports had claimed that the 16 GB base model would be discontinued and most probably will be replaced with a 32GBbase model, while at the top end the 256GB storage model would be available. Besides 32GB and 256GB it is heard that Apple will be offering a 128GB storage variant. It is observed that the screen panel reveals not only two sizes of the smart phone, but also the dual-lens camera, supposed for the larger variant. As of now we expect the iPhone to come with antenna bands on the edges in iPhone 7, iPhone 7 Plus, and iPhone 7 Premium. For connecting accessories they will also sport a Smart Connector at the back.