Western Digital Corp. (NASDAQ: WDC) announced that it has successfully developed its next generation 3D NAND technology, BiCS3, with 64 layers of vertical storage capability. Pilot production of the new technology has commenced in the Yokkaichi, Japan joint venture facilities and initial output is expected later this year. Western Digital expects meaningful commercial volumes of BiCS3 in the first half of calendar 2017.
“The launch of the next generation 3D NAND technology based on our industry-leading 64 layer architecture reinforces our leadership in NAND flash technology,” said Dr. Siva Sivaram, executive vice president, memory technology, Western Digital. “BiCS3 will feature the use of 3-bits-per-cell technology along with advances in high aspect ratio semiconductor processing to deliver higher capacity, superior performance and reliability at an attractive cost. Together with BiCS2, our 3D NAND portfolio has broadened significantly, enhancing our ability to address a full spectrum of customer applications in retail, mobile and data center.”
BiCS3, which has been developed jointly with Western Digital’s technology and manufacturing partner Toshiba, will be initially deployed in 256 gigabit capacity and will be available in a range of capacities up to half a terabit on a single chip. Western Digital expects volume shipments of BiCS3 for the retail market in the fourth calendar quarter of 2016 and to begin OEM sampling this quarter. Shipments of the company’s previous generation 3D NAND technology, BiCS2, continue to customers in retail and OEM.
Forward-Looking Statements
This news release contains certain forward-looking statements, including expectations for 3D NAND technology, including its development, timing for initial output, commercial volume production, product sampling and shipment, capabilities, performance improvements, applications, capacities and customers. There are a number of risks and uncertainties that may cause these forward-looking statements to be inaccurate including, among others: volatility in global economic conditions; business conditions and growth in the storage ecosystem; impact of competitive products and pricing; market acceptance and cost of commodity materials and specialized product components; actions by competitors; unexpected advances in competing technologies; our development and introduction of products based on new technologies and expansion into new data storage markets; risks associated with acquisitions, mergers and joint ventures; difficulties or delays in manufacturing; and other risks and uncertainties listed in the company’s filings with the Securities and Exchange Commission (the “SEC”), including the company’s Form 10-Q filed with the SEC on May 9, 2016, as well as SanDisk’s Form 10-Q filed with the SEC on May 2, 2016, to both of which your attention is directed. We do not intend to update the information contained in this release.
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